Polimero eta konpositeen teknologia

Ikerketaren helburu nagusia materialen, prozesamenduen eta diseinuen hurrengo belaunaldirako luzetarako eskala guztietarako oinarri zientifikoa sortzea da, bizkor hazten ari den egitura mailako polimeroaren eta konpositearen esparruaren oinarri izan dadin. Jarduera ikerketako bost esparru nagusiren inguruan antolatuta dago:

1. Diseinu arina (Diseinu kontzeptuala eta materialen hautaketa; Egitura mailako materialak eta egiturak; Material ugariko egiturak).

2. Egitura mailako integritatea (Energia xurgatzen duten materialak eta kaltea toleratzen dutenak; Inpakturako diseinua; Nekerako diseinua; Tribologia).

3. Konpositeen Prozesu Aurreratuak (Autoklabe teknologietatik kanpo; Prozesu termoplastiko likidoak; Meta-zuntzezko laminatuak; NDT fabrikaziorako).

4. Osasunerako biopolimeroak (Material bioxurgagarriak; Protesi iraunkorretarako material biobateragarriak; Mikro-nanoteknologiak).

5. Iraunkortasuna (Birziklapena eta Berreskurapena; zuntz naturalezko konpositeak; iturri berriztagarrietako polimeroak).

Automobilgintzarako, ingeniaritza zibilerako, makina-erremintarako, etxeko aplikazioetarako eta biomekanikarako aplikazioa garatu dituzte.

Onging projects


  1. LIGHTCARBONCARS: Automotive lightweighting by low cost carbon fiber composites.
  2. CAFI: High fatigue and impact strength carbon fiber composites for automotive industry.
  3. CRASHINT: Crashworthiness of themoplastic matrix smart composites.
  4. AutoRTM: Thermoplastic RTM composites for automotive industry.
  5. MICROINJECT: Microinjection of plastics.
  6. Design and manufacturing of scaffolds for tissue engineering based on biopolymer nanocomposites.
  7. 3Rs: Composites from renewable polymer and reinforcements.


Up

Recent publications


  1. The role of POSS on the thermo-mechanical properties of polyoxymethylene copolymer based nanocomposites [J. Nanosci. Nanotech., acepted 18 Mars 2009].
  2. Strain rate effect on interlaminar shear strength of carbon fibre reinforced epoxy and pCBT composites [ICCM-17 (2009) Edinburgh].
  3. Setting up of pull-out test at impact strain rates for SMA wire/pCBT adaptive composite [ICCM-17 (2009) Edinburgh].
  4. Constitutive model taking into account the strain rate for uniaxial NiTi SMA under low velocity impact conditions [Smart Mater. Struct., 17 (2008) doi:10.1088/0964-1726/17/6/065033].
  5. Effects of microstructure on wear behaviour of wood reinforced polypropylene composite [Wear 265 (2008) 606].
  6. Iso-strain rate material behaviour curves applied to the finite element impact simulation [Polym. Testing 27 (2008) 84].
  7. Electroactive pressure sensors for smart structures [Adv. Sci. Tech. 56 (2008) 122].
  8. Comparison between the dynamical properties of polymer concrete and grey cast iron for machine tool applications [Mater. Design 28 (2007) 1461].
  9. Novel all polymer microfluidic devices monolithically integrated within metallic electrodes for SDS-CGE of proteins [J. Micromech. and Microeng. 17 (2007) 1289].
  10. Effect of dissolution based recycling on the degradation and the mechanical properties of acrylonitrile-butadiene-styrene [Polym. Degr. Stab. 91 (2006) 2768].
  11. Failure of multimaterial fusion bonding interface generated during over-injection molding/thermoforming hybrid process [J. App. Polymer Sci. 102 (2006) 261].
  12. Characterisation of the impact behaviour of polymer thermoplastics [Polym. Testing 24 (2005)145].


Up

Infrastructures

 

Materials characterization

•    Mechanical testing: Instrumented falling weight (4.6 m/s, 70 kg, 755J, -70÷150 ºC) and pendulum impact test, Fatigue (100 kN, -120÷315 ºC), Static tensile/bending/fracture (1÷400 kN) tests, Tribometre.

•    Microstructure: Low vacuum SEM, C-SCAN phased array, High and low speed infrared cameras, DSC.

Processing equipment on lab scale

•    Plastic: Injection moulding (60 Tm), Mini-injection (maximum load 14 g), Thermoforming (400 x 400 mm2).

•    Composite: Thermosetting and thermoplastic RTM, Filament winding, Pultrusion, Stamp forming.

CAD/CAM/CAE

•    ABAQUS STANDARD/EXPLICIT, COSMOS, PATRAN/NASTRAN, ESACOMP, MARC.

•    CATIA, IDEAS, SOLIDWORKS, UNIGRAPHICS, CES-Edupack.

 

Up

Contact

Jon Aurrekoetxea

Up